Atomically Thin Integrated Circuits for Technology in the 21st Century

Monday, October 1, 2018 - 2:30pm

Manufacturing of paper, which started two thousand years ago, simplified all aspects of information technology: generation, processing, communication, delivery and storage. Similarly powerful changes have been seen in the past century through the development of integrated circuits based on silicon. In this talk, I will discuss how we can realize these integrated circuits thin and free-standing, just like paper, using two-dimensional materials and how they can impact the modern information technology. In order to build these atomically thin circuits, we developed a series of approaches that are scalable and precise. They include wafer-scale synthesis of three atom thick semiconductors and heterojunctions (Nature, 2012), and atomically thin films and devices that are vertically stacked to form more complicated circuitry (Nature, 2017). Once realized, these atomically thin circuits will be foldable and actuatable, which will further increase the device density and functionality. The fact that these circuits could be realized and function without any substrate will allow them to be used tether-free (or wirelessly) in environments not previously accessible to conventional circuits, such as water, air or in space.

Location: 
3 Le Conte Hall- UCB
Speaker: 
Affiliation: 
University of Chicago